Frequent BSOD on new windows 11 build

I have recently finished a new desktop build, running Windows 11, and I keep occasionally having BSOD. These seem to be at unpredictable moments (sometimes after few hours of use, sometimes several times in the span of half an hour).

From the Event Viewer I can see several Critical events

> The system has rebooted without cleanly shutting down first. This error could be caused if the system stopped responding, crashed, or lost power unexpectedly.
as one would expect.

There are several Error ones as well.

I have so far tried different things, including:

• Resetting BIOS settings to default (despite they were never changed to begin with);
• Upgrading motherboard firmware to more recent versions (through GIGABYTE Control Center, as the motherboard is a GIGABYTE Z790 UD);
• I kept the CPU temp under observation, but did not see any correlation between moment of crashes and particularly high temperatures;
• Running memory diagnostic tool, which returned no issue.

What can I do to better understand what could be the issue, and possibly solve it?

Thanks in advance for the support.

---

Attaching below some system summary information:

HWiNFO® 64 Version 8.22-5670

BOB -----------------------------------------------------------------------

[Current Computer]

Computer Name: BOB

Computer Brand Name: GIGABYTE Z790 UD

[Operating System]

Operating System: Microsoft Windows 11 Professional (x64) Build 26100.3476 (24H2)

UEFI Boot: Present

Secure Boot: Disabled

Hypervisor-protected Code Integrity (HVCI): Disabled

Virtual Machine Warning: Microsoft Hyper-V is active. Some results may not reflect real hardware !

Central Processor(s) ------------------------------------------------------

[CPU Unit Count]

Number Of Processor Packages (Physical): 1

Number Of Processor Cores: 16

Number Of Logical Processors: 24

Intel Core i7-13700K ------------------------------------------------------

[General Information]

Processor Name: Intel Core i7-13700K

Original Processor Frequency: 3400.0 MHz

Original Processor Frequency [MHz]: 3400

CPU ID: 000B0671

CPU Brand Name: 13th Gen Intel(R) Core(TM) i7-13700K

CPU Vendor: GenuineIntel

CPU Type: Production Unit

CPU Platform: Socket V (LGA1700)

[Operating Points]

[IA Overclocking]

[GT Overclocking]

[CLR (CBo/LLC/Ring) Overclocking]

[GT Media Overclocking]

[SA Overclocking]

[L2 E-core Overclocking]

[Cache and TLB]

L1 Cache (P-cores): Instruction: 8 x 32 KBytes, Data: 8 x 48 KBytes

L1 Cache (E-cores): Instruction: 8 x 64 KBytes, Data: 8 x 32 KBytes

L2 Cache (P-cores): Integrated: 8 x 2 MBytes

L2 Cache (E-cores): Integrated: 2 x 4 MBytes

L3 Cache: 30 MBytes

[Standard Feature Flags]

[Extended Feature Flags]

[Vulnerability Mitigation Mechanisms]

[Enhanced Features]

[CPU SKU Features]

[Voltage Regulator (SVID)]

[Memory Ranges]

[MTRRs]

Motherboard ---------------------------------------------------------------

[Computer]

Computer Brand Name: GIGABYTE Z790 UD

[Motherboard]

Motherboard Model: GIGABYTE Z790 UD

Motherboard Chipset: Intel Z790 (Raptor Lake-S PCH)

Motherboard Slots: 4xPCI Express x1, 1xPCI Express x4, 1xPCI Express x16

PCI Express Version Supported: v5.0

USB Version Supported: v3.2

[BIOS]

BIOS Manufacturer: American Megatrends International, LLC.

BIOS Date: 01/07/2025

BIOS Version: F13

UEFI BIOS: Capable

[GIGABYTE BIOS Settings]

GIGABYTE PerfDrive: Optimization

Low Latency: Auto

High Bandwidth: Auto

Ring to Core Offset: Auto

Energy Efficient Turbo: Auto

Intel Turbo Boost Max Technology 3.0: Enabled

CPU Enhanced Halt State (C1E): Auto

C6/C7 State Support: Auto

C8 State Support: Auto

C10 State Support: Auto

Package C State Limit: Auto

CPU Core PLL Overvoltage: Auto

RING PLL Overvoltage: Auto

SA PLL Overvoltage: Auto

GT PLL Overvoltage: Auto

ATOM PLL Overvoltage: Auto

MC PLL Overvoltage: Auto

CPU Vcore Loadline Calibration: Auto

CPU Internal AC/DC Loadline: Auto

IA AC Loadline: 0.90 mOhm

IA DC Loadline: 0.90 mOhm

Fine Granularity Mode: Auto

Super-IO/LPC Chip: ITE IT8689E

Trusted Platform Module (TPM) Chip: Hardware TPM, version 2.0

Intel ME ------------------------------------------------------------------

[ME Host Status]

[Intel Manageability Engine Features]

[ME Firmware Capabilities]

[ME Firmware Feature State]

[ME Firmware Platform Type]

Memory --------------------------------------------------------------------

[General Information]

Total Memory Size: 64 GBytes

Total Memory Size [MB]: 65536

[Current Performance Settings]

Current Memory Clock: 2400.0 MHz

Current Timing (tCAS-tRCD-tRP-tRAS): 40-40-40-76

Memory Channels Supported: 4

Memory Channels Active: 4

Command Rate (CR): 2T

Read to Read Delay (tRDRD_SG/TrdrdScL) Same Bank Group: 12T

Read to Read Delay (tRDRD_DG/TrdrdScDlr) Different Bank Group: 8T

Read to Read Delay (tRDRD_SD) Same DIMM: 14T

Read to Read Delay (tRDRD_DD) Different DIMM: 14T

Write to Write Delay (tWRWR_SG/TwrwrScL) Same Bank Group: 26T

Write to Write Delay (tWRWR_DG/TwrwrScDlr) Different Bank Group: 8T

Write to Write Delay (tWRWR_SD) Same DIMM: 14T

Write to Write Delay (tWRWR_DD) Different DIMM: 14T

Read to Write Delay (tRDWR_SG/TrdwrScL) Same Bank Group: 18T

Read to Write Delay (tRDWR_DG/TrdwrScDlr) Different Bank Group: 18T

Read to Write Delay (tRDWR_SD) Same DIMM: 20T

Read to Write Delay (tRDWR_DD) Different DIMM: 20T

Write to Read Delay (tWRRD_SG/TwrrdScL) Same Bank Group: 72T

Write to Read Delay (tWRRD_DG/TwrrdScDlr) Different Bank Group: 54T

Write to Read Delay (tWRRD_SD) Same DIMM: 12T

Write to Read Delay (tWRRD_DD) Different DIMM: 12T

Read to Precharge Delay (tRTP): 17T

Write to Precharge Delay (tWTP): 82T

Write Recovery Time (tWR): 71T

RAS# to RAS# Delay (tRRD_L): 12T

RAS# to RAS# Delay (tRRD_S): 8T

Row Cycle Time (tRC): 116T

Refresh Cycle Time (tRFC): 383T

Four Activate Window (tFAW): 32T

Row: 1 [BANK 0/DDR5-A2] - 32 GB PC5-44800 DDR5 SDRAM Corsair CMK64GX5M2B5600C40

[General Module Information]

Module Number: 1

Module Size: 32 GBytes

Memory Type: DDR5 SDRAM

Module Type: Unbuffered DIMM (UDIMM)

Memory Speed: 2800.0 MHz (DDR5-5600 / PC5-44800)

Module Manufacturer: Corsair

Module Part Number: CMK64GX5M2B5600C40

Module Revision: 0.0

Module Serial Number: N/A

Module Manufacturing Date: Year: 2023, Week: 38

Module Manufacturing Location: 0

SDRAM Manufacturer: Micron

DRAM Steppping: B-Die (4.2)

Error Check/Correction: None

[Module Characteristics]

Rank Mix: Symmetrical

Row Address Bits: 16

Column Address Bits: 10

Module Density: 16384 Mb

Dies Per Package: 1

Device Width: x8

Number Of Bank Groups: 8

Banks Per Group: 4

Number Of Ranks: 2

Module Device Width: x4

Channels Per DIMM: x2

Primary Bus Width: x32

Bus Extension: None

Module Voltage (VDD): Nominal: 1.1V, Operable: 1.1V, Endurant: 1.1V

Module Voltage (VDDQ): Nominal: 1.1V, Operable: 1.1V, Endurant: 1.1V

Module Voltage (VPP): Nominal: 1.8V, Operable: 1.8V, Endurant: 1.8V

Wide Temperature Sense: Not Supported

Bounded Fault: Not Supported

BL32: Not Supported

Non-Standard Core Timings: Not Supported

Minimum SDRAM Cycle Time (tCKAVGmin): 0.41600 ns (2400 MHz)

Maximum SDRAM Cycle Time (tCKAVGmax): 1.00000 ns

CAS# Latencies Supported: 22, 28, 30, 32, 36, 40, 42

Minimum CAS# Latency Time (tAAmin): 16.666 ns

Minimum RAS# to CAS# Delay (tRCDmin): 16.666 ns

Minimum Row Precharge Time (tRPmin): 16.666 ns

Minimum Active to Precharge Time (tRASmin): 32.000 ns

Supported Module Timing at 2400.0 MHz: 40-40-40-77

Supported Module Timing at 1800.0 MHz: 30-30-30-58

Supported Module Timing at 1600.0 MHz: 28-27-27-52

Minimum Active to Active/Refresh Time (tRCmin): 48.666 ns

Minimum Refresh Recovery Time Delay (tRFC1min): 295.000 ns

Minimum Refresh Recovery Time Delay (tRFC2min): 160.000 ns

Minimum Refresh Recovery Time Delay (tRFCsbmin): 130.000 ns

Minimum Refresh Recovery Time Delay (tRFC1dlrmin): 0.000 ns

Minimum Refresh Recovery Time Delay (tRFC2dlrmin): 0.000 ns

Minimum Refresh Recovery Time Delay (tRFCsbdlrmin): 0.000 ns

Activate to Activate Command Delay for Same Bank Group (tRRD_L): 5.000 ns

Read to Read Command Delay for Same Bank Group (tCCD_L): 5.000 ns

Write to Write Command Delay for Same Bank Group (tCCD_L_WR): 20.000 ns

Write to Write Command Delay for Same Bank Group, Second Write not RMW (tCCD_L_WR2): 10.000 ns

Four Activate Window (tFAW): 13.333 ns

Write to Read Command Delay for Same Bank Group (tCCD_L_WTR): 10.000 ns

Write to Read Command Delay for Different Bank Group (tCCD_S_WTR): 2.500 ns

Read to Precharge Command Delay (tRTP): 7.500 ns

SPD Manufacturer: IDT

SPD Type: SPD5118

SPD Steppping: 1.2

PMIC0 Device: Present

PMIC0 Manufacturer: Richtek Power

PMIC0 Device Type: PMIC5100

PMIC0 Stepping: 1.2

PMIC0 Type: Small PMIC (Low Current)

PMIC0 Secure Mode: Disabled

Thermal Sensor 0: Not Present

Thermal Sensor 1: Not Present

DRAM Temperature Grade: Extended (XT) : 0 - 95 C

Heat Spreader: Present

Vin_bulk Fuse: Not Present

Vin_bulk Transient Voltage Suppression (TVS): Not Present

Vin_mgmt Transient Voltage Suppression (TVS): Not Present

Module Nominal Height: 35 - 36 mm

Module Maximum Thickness (Front): 3 - 4 mm

Module Maximum Thickness (Back): 3 - 4 mm

[Intel Extreme Memory Profile (XMP)]

XMP Version: 3.0

XMP Revision: 1.2

Number of PMICs: 1

XMP(OC) PMIC: Not Supported

PMIC OC: Disabled

PMIC Voltage Default Step Size: 5 mV

OC Global Reset Function: Not Supported

[Enthusiast/Certified Profile [Enabled]]

Profile Name: Profile 1

Recommended Channel Config: 1 DIMM per Channel

Module VDD Voltage Level: 1.25 V

Module VPP Voltage Level: 1.80 V

Module VDDQ Voltage Level: 1.25 V

Memory Controller Voltage Level: 1.20 V

Minimum SDRAM Cycle Time (tCKAVGmin): 0.35700 ns (2800 MHz)

CAS# Latencies Supported: 22, 28, 30, 32, 36, 40, 42, 46, 50

Minimum CAS# Latency Time (tAAmin): 14.285 ns

Minimum RAS# to CAS# Delay (tRCDmin): 14.285 ns

Minimum Row Precharge Time (tRPmin): 14.285 ns

Minimum Active to Precharge Time (tRASmin): 27.489 ns

Supported Module Timing at 2800.0 MHz: 40-40-40-77

Supported Module Timing at 2400.0 MHz: 36-35-35-66

Supported Module Timing at 2200.0 MHz: 32-32-32-61

Supported Module Timing at 2000.0 MHz: 30-29-29-55

Minimum Active to Active/Refresh Time (tRCmin): 41.769 ns

Minimum Refresh Recovery Time Delay (tRFC1min): 295.000 ns

Minimum Refresh Recovery Time Delay (tRFC2min): 160.000 ns

Minimum Refresh Recovery Time Delay (tRFCsb): 130.000 ns

Minimum Minimum Write Recovery Time (tWRmin): 30.000 ns

System Command Rate Mode: 2N

Real-Time Memory Frequency Overclocking: Supported

Intel Dynamic Memory Boost: Supported

Minimum Read to Read Command Delay Time, Same Bank Group (tCCD_Lmin): 5.000 ns

Minimum Write to Write Command Delay Time, Same Bank Group (tCCD_L_WRmin): 20.000 ns

Minimum Write to Write Command Delay Time, Second Write not RMW, Same Bank Group (tCCD_L_WR2min): 10.000 ns

Minimum Write to Read Command Delay Time, Same Bank Group (tCCD_L_WTRmin): 10.000 ns

Minimum Write to Read Command Delay Time, Different Bank Group (tCCD_S_WTRmin): 2.500 ns

Minimum Active to Active Command Delay Time, Same Bank Group (tRRD_Lmin): 5.000 ns

Minimum Read to Precharge Command Delay Time (tRTPmin): 7.500 ns

Minimum Four Activate Window (tFAWmin): 11.428 ns

Row: 3 [BANK 0/DDR5-B2] - 32 GB PC5-44800 DDR5 SDRAM Corsair CMK64GX5M2B5600C40

[General Module Information]

Module Number: 3

Module Size: 32 GBytes

Memory Type: DDR5 SDRAM

Module Type: Unbuffered DIMM (UDIMM)

Memory Speed: 2800.0 MHz (DDR5-5600 / PC5-44800)

Module Manufacturer: Corsair

Module Part Number: CMK64GX5M2B5600C40

Module Revision: 0.0

Module Serial Number: N/A

Module Manufacturing Date: Year: 2023, Week: 38

Module Manufacturing Location: 0

SDRAM Manufacturer: Micron

DRAM Steppping: B-Die (4.2)

Error Check/Correction: None

[Module Characteristics]

Rank Mix: Symmetrical

Row Address Bits: 16

Column Address Bits: 10

Module Density: 16384 Mb

Dies Per Package: 1

Device Width: x8

Number Of Bank Groups: 8

Banks Per Group: 4

Number Of Ranks: 2

Module Device Width: x4

Channels Per DIMM: x2

Primary Bus Width: x32

Bus Extension: None

Module Voltage (VDD): Nominal: 1.1V, Operable: 1.1V, Endurant: 1.1V

Module Voltage (VDDQ): Nominal: 1.1V, Operable: 1.1V, Endurant: 1.1V

Module Voltage (VPP): Nominal: 1.8V, Operable: 1.8V, Endurant: 1.8V

Wide Temperature Sense: Not Supported

Bounded Fault: Not Supported

BL32: Not Supported

Non-Standard Core Timings: Not Supported

Minimum SDRAM Cycle Time (tCKAVGmin): 0.41600 ns (2400 MHz)

Maximum SDRAM Cycle Time (tCKAVGmax): 1.00000 ns

CAS# Latencies Supported: 22, 28, 30, 32, 36, 40, 42

Minimum CAS# Latency Time (tAAmin): 16.666 ns

Minimum RAS# to CAS# Delay (tRCDmin): 16.666 ns

Minimum Row Precharge Time (tRPmin): 16.666 ns

Minimum Active to Precharge Time (tRASmin): 32.000 ns

Supported Module Timing at 2400.0 MHz: 40-40-40-77

Supported Module Timing at 1800.0 MHz: 30-30-30-58

Supported Module Timing at 1600.0 MHz: 28-27-27-52

Minimum Active to Active/Refresh Time (tRCmin): 48.666 ns

Minimum Refresh Recovery Time Delay (tRFC1min): 295.000 ns

Minimum Refresh Recovery Time Delay (tRFC2min): 160.000 ns

Minimum Refresh Recovery Time Delay (tRFCsbmin): 130.000 ns

Minimum Refresh Recovery Time Delay (tRFC1dlrmin): 0.000 ns

Minimum Refresh Recovery Time Delay (tRFC2dlrmin): 0.000 ns

Minimum Refresh Recovery Time Delay (tRFCsbdlrmin): 0.000 ns

Activate to Activate Command Delay for Same Bank Group (tRRD_L): 5.000 ns

Read to Read Command Delay for Same Bank Group (tCCD_L): 5.000 ns

Write to Write Command Delay for Same Bank Group (tCCD_L_WR): 20.000 ns

Write to Write Command Delay for Same Bank Group, Second Write not RMW (tCCD_L_WR2): 10.000 ns

Four Activate Window (tFAW): 13.333 ns

Write to Read Command Delay for Same Bank Group (tCCD_L_WTR): 10.000 ns

Write to Read Command Delay for Different Bank Group (tCCD_S_WTR): 2.500 ns

Read to Precharge Command Delay (tRTP): 7.500 ns

SPD Manufacturer: IDT

SPD Type: SPD5118

SPD Steppping: 1.2

PMIC0 Device: Present

PMIC0 Manufacturer: Richtek Power

PMIC0 Device Type: PMIC5100

PMIC0 Stepping: 1.2

PMIC0 Type: Small PMIC (Low Current)

PMIC0 Secure Mode: Disabled

Thermal Sensor 0: Not Present

Thermal Sensor 1: Not Present

DRAM Temperature Grade: Extended (XT) : 0 - 95 C

Heat Spreader: Present

Vin_bulk Fuse: Not Present

Vin_bulk Transient Voltage Suppression (TVS): Not Present

Vin_mgmt Transient Voltage Suppression (TVS): Not Present

Module Nominal Height: 35 - 36 mm

Module Maximum Thickness (Front): 3 - 4 mm

Module Maximum Thickness (Back): 3 - 4 mm

[Intel Extreme Memory Profile (XMP)]

XMP Version: 3.0

XMP Revision: 1.2

Number of PMICs: 1

XMP(OC) PMIC: Not Supported

PMIC OC: Disabled

PMIC Voltage Default Step Size: 5 mV

OC Global Reset Function: Not Supported

[Enthusiast/Certified Profile [Enabled]]

Profile Name: Profile 1

Recommended Channel Config: 1 DIMM per Channel

Module VDD Voltage Level: 1.25 V

Module VPP Voltage Level: 1.80 V

Module VDDQ Voltage Level: 1.25 V

Memory Controller Voltage Level: 1.20 V

Minimum SDRAM Cycle Time (tCKAVGmin): 0.35700 ns (2800 MHz)

CAS# Latencies Supported: 22, 28, 30, 32, 36, 40, 42, 46, 50

Minimum CAS# Latency Time (tAAmin): 14.285 ns

Minimum RAS# to CAS# Delay (tRCDmin): 14.285 ns

Minimum Row Precharge Time (tRPmin): 14.285 ns

Minimum Active to Precharge Time (tRASmin): 27.489 ns

Supported Module Timing at 2800.0 MHz: 40-40-40-77

Supported Module Timing at 2400.0 MHz: 36-35-35-66

Supported Module Timing at 2200.0 MHz: 32-32-32-61

Supported Module Timing at 2000.0 MHz: 30-29-29-55

Minimum Active to Active/Refresh Time (tRCmin): 41.769 ns

Minimum Refresh Recovery Time Delay (tRFC1min): 295.000 ns

Minimum Refresh Recovery Time Delay (tRFC2min): 160.000 ns

Minimum Refresh Recovery Time Delay (tRFCsb): 130.000 ns

Minimum Minimum Write Recovery Time (tWRmin): 30.000 ns

System Command Rate Mode: 2N

Real-Time Memory Frequency Overclocking: Supported

Intel Dynamic Memory Boost: Supported

Minimum Read to Read Command Delay Time, Same Bank Group (tCCD_Lmin): 5.000 ns

Minimum Write to Write Command Delay Time, Same Bank Group (tCCD_L_WRmin): 20.000 ns

Minimum Write to Write Command Delay Time, Second Write not RMW, Same Bank Group (tCCD_L_WR2min): 10.000 ns

Minimum Write to Read Command Delay Time, Same Bank Group (tCCD_L_WTRmin): 10.000 ns

Minimum Write to Read Command Delay Time, Different Bank Group (tCCD_S_WTRmin): 2.500 ns

Minimum Active to Active Command Delay Time, Same Bank Group (tRRD_Lmin): 5.000 ns

Minimum Read to Precharge Command Delay Time (tRTPmin): 7.500 ns

Minimum Four Activate Window (tFAWmin): 11.428 ns

Video Adapter -------------------------------------------------------------

Intel UHD Graphics --------------------------------------------------------

[Video Chipset]

Video Chipset: Intel UHD Graphics

Video Chipset Codename: Raptor Lake-S/HX GT1

Video Memory: 30966104 KBytes of SDRAM

[Video Card]

Video Card: Intel Raptor Lake-S - Integrated Graphics [GIGABYTE]

Video Bus: PCIe v2.0 x0 (5.0 GT/s) @ [DISABLED]

GPU Type: Integrated

Video RAMDAC: Internal

[Performance]

Firmware Version: 17.0.1081

Resizable BAR (ReBAR) Support: Not Supported

[Driver Information]

Driver Manufacturer: Intel Corporation

Driver Description: Intel(R) UHD Graphics 770

Driver Provider: Intel Corporation

Driver Version: 32.0.101.6129

Driver Date: 18-Oct-2024

DCH/UWD Driver: Not Capable

DeviceInstanceId PCI\VEN_8086&DEV_A780&SUBSYS_D0001458&REV_04\3&11583659&0&10

Location Paths PCIROOT(0)#PCI(0200)

NVIDIA GeForce RTX 2060 ---------------------------------------------------

[Video Chipset]

Video Chipset: NVIDIA GeForce RTX 2060

Video Chipset Codename: TU106-200A

Video Memory: 6144 MBytes of GDDR6 SDRAM [Micron]

[Video Card]

Video Card: MSI RTX 2060 Gaming Z

Video Bus: PCIe v3.0 x16 (8.0 GT/s) @ x16 (2.5 GT/s)

GPU Type: Discrete

Video RAMDAC: Integrated RAMDAC

Video BIOS Version: 90.06.2e.40.d3 [UEFI]

Video Chipset Revision: A1

[Performance]

ASIC Manufacturer: TSMC

ASIC Serial Number: 379433650577

NVIDIA SLI Status: Not Present

Resizable BAR (ReBAR) Support: Supported

Resizable BAR (ReBAR) State: Disabled (256 MB)

[Driver Information]

Driver Manufacturer: NVIDIA

Driver Description: NVIDIA GeForce RTX 2060

Driver Provider: NVIDIA

Driver Version: 32.0.15.7260 (GeForce 572.60)

Driver Date: 25-Feb-2025

DCH/UWD Driver: Capable

DeviceInstanceId PCI\VEN_10DE&DEV_1F08&SUBSYS_37521462&REV_A1\4&8BD6E8D&0&0008

Location Paths PCIROOT(0)#PCI(0100)#PCI(0000)

Network -------------------------------------------------------------------

RealTek Semiconductor RTL8125 Gaming 2.5GbE Family Ethernet Controller ----

[General Information]

Network Card: RealTek Semiconductor RTL8125 Gaming 2.5GbE Family Ethernet Controller

Vendor Description:

MAC Address: 74-56-3C-61-F3-12

[Capabilities]

Maximum Link Speed: 2500 Mbps

Current Link Speed: 2500 Mbps

Transmit Buffer Size: 6201344 Bytes

Receive Buffer Size: 1570816 Bytes

Hardware ID: PCI\VEN_10EC&DEV_8125&SUBSYS_E0001458&REV_05

[Driver Information]

Driver Manufacturer: Realtek

Driver Description: Realtek Gaming 2.5GbE Family Controller

Driver Provider: Realtek

Driver Version: 1125.21.903.2024

Driver Date: 03-Sep-2024

DeviceInstanceId PCI\VEN_10EC&DEV_8125&SUBSYS_E0001458&REV_05\01000000684CE00000

Location Paths PCIROOT(0)#PCI(1C02)#PCI(0000)

Intel Wi-Fi 6E AX210 160MHz -----------------------------------------------

[General Information]

Network Card: Intel Wi-Fi 6E AX210 160MHz

Vendor Description: Microsoft

MAC Address: 70-A8-D3-56-1F-44

[Capabilities]

Maximum Link Speed: 400 Mbps

Current Link Speed: 400 Mbps

Transmit Buffer Size: Unknown

Receive Buffer Size: Unknown

Hardware ID: PCI\VEN_8086&DEV_2725&SUBSYS_00248086&REV_1A

[Driver Information]

Driver Manufacturer: Intel

Driver Description: Intel(R) Wi-Fi 6E AX210 160MHz

Driver Provider: Intel

Driver Version: 23.120.0.3

Driver Date: 06-Feb-2025

DeviceInstanceId PCI\VEN_8086&DEV_2725&SUBSYS_00248086&REV_1A\4&13053A02&0&00E6

Location Paths PCIROOT(0)#PCI(1C06)#PCI(0000)