Interpretation of Windows Embedded CE Stress Tool Results
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8/27/2008
The Windows Embedded CE Stress tool displays overall test results under one of the following conditions:
- The stress test terminates properly, the target device is still running, and none of the specified failure conditions are met.
The tool indicates that the test passed. - The target device exceeds the low-memory threshold, if you specified a low-memory threshold.
The tool reports a failure. Examine the System Info tables in the .xml log file for the test to view memory use of test modules and system processes. - The harness determines that one or more test modules exceed the hang warning trigger.
The tool reports a failure. Investigate by using a debugger. For information about debugger support in Windows Embedded CE, see System Debugging Tools. - One or more test modules exceed the failure limit.
The tool reports a failure. Examine the debug output for specific test module failure logging. - The target device crashes, hangs, or hits a breakpoint.
The tool reports a communications failure because it can no longer communicate with the target device. Investigate by using a debugger. For information about debugger support in Windows Embedded CE, see System Debugging Tools.
The Windows Embedded CE Stress tool also displays general information on the development workstation about the stress run. The Results panel displays information such as the total time run, the total number of test modules run, the total number of test cases run, and the test case pass percentage. The Windows Embedded CE Stress tool updates information during the test run.
You can find detailed test results in the .xml log file. For more information about the .xml log file, see Logged Information for the Windows Embedded CE Stress Tool.