Running the Windows Embedded CE Stress Tool (Windows Embedded CE 6.0)
1/6/2010
With the Windows Embedded CE Stress tool, you can test the stability of your Windows Embedded CE–based run-time image by using a mix of test modules tailored to the run-time image. You can write custom test modules for your own drivers, applications, and so on, and then add these test modules to the mix of test modules. With custom test modules, you can test the stability of your drivers and applications and test their interoperability with other parts of the operating system. You run the tool from the Windows Embedded CE 6.0 Test Kit (CETK). For more information about writing a custom test module, see Custom Module Creation for the Windows Embedded CE Stress Tool.
To run the Windows Embedded CE Stress tool from the CETK window
Connect the target device to the CETK.
For information about connecting a target device to the CETK, see CETK Setup.
In the Windows Embedded CE Test Kit window, right-click on the target device, choose Tools, and then choose Windows Embedded CE Stress.
If you want, modify the behavior of the test by changing specified options.
For information about options for the Windows Embedded CE Stress tool, see Options for the Windows Embedded CE Stress Tool.
Choose Launch.
You should see a significant amount of activity on the display of the target device. If you have connected an instance of Platform Builder to the target device, the Output window in the Platform Builder integrated development environment (IDE) should display information about execution of the test modules.